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d a t a sh eet product speci?cation supersedes data of march 1991 file under integrated circuits, ic02 1996 nov 20 integrated circuits TDA9820 multistandard/dual channel tv fm intercarrier sound demodulator
1996 nov 20 2 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 features multistandard application for sound standards m, b/g, i and d/k two alignment-free pll fm demodulators four-input source selector for one of the two fm demodulators automatic second sound carrier mute mono and dual channel application low power consumption few external components required. general description the TDA9820 is a monolithic, integrated, multistandard tv fm intercarrier sound demodulator for all fm standards. the circuit contains two separate fm demodulators using phase locked loop (pll) reference frequency generation. the circuit requires a minimum number of external components. quick reference data ordering information symbol parameter conditions min. typ. max. unit v p supply voltage (pin 14) 4.5 5.0 8.8 v i p supply current (pin 14) 23 30 37 ma i m ac peak current (pins 7 and 8) -- 1.5 ma v i(rms) input signal (rms value) - 150 250 m v v o(rms) output signal (pins 7 and 8; rms value) d f i = 50 khz 0.4 0.5 0.6 v signal plus noise-to-noise ratio (pins 7 and 8) in accordance with ccir 468-3 64 68 - db a 8/7 crosstalk attenuation f = 50 to 12500 hz 60 70 - db rr supply voltage ripple rejection (pins 7 and 8) v rr < 200 mv; f = 70 hz 16 20 - db t amb operating ambient temperature 0 - 70 c type number package name description version TDA9820 dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-1 TDA9820t so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1 sn + n -------------- 40 db = sn + n --------------
1996 nov 20 3 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 block diagram fig.1 block diagram. (1) resistor and potentiometer between capacitor and earth are inserted if adjustment of stereo channel separation is required. handbook, full pagewidth TDA9820 v = 4.5 to 8.8 v p (1) control unit 7-stage limiter amplifier 1 vco 1 7-stage limiter amplifier 2 vco 2 optional stereo channel separation adjustment v af1 v af2 s 1 s 2 standard switch mute intercarrier vco ref supply 11 12 14 13 15 16 1 3 2 10 mha420 9 + - 7 + - 6 5 8 4.5 mhz (m) 5.5 mhz (b/g) 6.0 mhz (i) 6.5 mhz (d/k) 4.72 mhz (m) 5.74 mhz (b/g) 6.74 mhz (d/k) or or (1) r s r pot
1996 nov 20 4 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 pinning symbol pin description in 1(b/g) 1 intercarrier input 1 at 5.5 mhz in 1(d/k) 2 intercarrier input 1 at 6.5 mhz in 1(m) 3 intercarrier input 1 at 4.5 mhz n.c. 4 not connected s 1 5 standard switch bit 1 input s 2 6 standard switch bit 2 input v af2 7 audio output voltage 2 v af1 8 audio output voltage 1 c 1 9 decoupling capacitor 1 c 2 10 decoupling capacitor 2 vco ref 11 vco reference c stab 12 supply voltage stabilization gnd 13 ground v p 14 supply voltage in 2 15 intercarrier input 2 in 1(i) 16 intercarrier input 1 at 6.0 mhz fig.2 pin configuration. handbook, halfpage TDA9820 mha529 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 in 1(b/g) in 1(d/k) in 1(m) s 1 s 2 v af2 v af1 n.c. in 1(i) in 2 v p c stab vco ref c 2 c 1 gnd
1996 nov 20 5 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 functional description the complete circuit consists of two separate channels, each consisting of a limiter-amplifier, fm demodulator and af amplifier. circuit operation is also described in fig.1. source selector the intercarrier signal is fed through external ceramic band-pass filters which are tuned to the sound carrier frequencies. one of the four filtered sound carriers from pins 1, 2, 3 or 16 is fed to limiter-amplifier 1 via the appropriate electronic switch in the source selector. the electronic switch of the sound carrier is selected by the control unit (see table 1). the second sound carrier of the intercarrier signal is directly fed from pin 15 to limiter-amplifier 2. fm demodulators each limiter-amplifier is ac-coupled into a fm demodulator. the integrated fm demodulator plls are alignment-free. the fm demodulator outputs are amplified to 500 mv (rms value). high amplification and dc error signals of the plls, which are superimposed on the fm demodulator outputs, require dc decoupling at pins 9 and 10 of the af amplifier inputs. stereo channel separation adjustment (optional) optimal stereo channel separation is achieved by adjusting v af1 (pin 8) and v af2 (pin 7) as follows: 1. v af1 by a resistor in series with the dc decoupling capacitor at pin 9 2. v af2 by a variable resistor in series with the dc decoupling capacitor on pin 10 to the same voltage as v af1 . second sound carrier mute the output of the second fm demodulator is muted when the signal level (signal and/or noise) at pin 15 is less than typically 0.5 mv (rms value). this avoids an incorrect stereo or dual sound identification when a mono signal is transmitted. therefore, with a mono transmission, there is no audio output at pin 7. when the signal level at pin 15 is greater than typically 1.0 mv (rms value) mute is switched off. control unit the control unit selects the required sound standard according to the voltages on pin 5 and pin 6. the control unit performs the following: 1. selects the free-running frequencies of vco1 and vco2 2. switches the source selector (the four possible combinations are shown in table 1). table 1 logic table; note 1 note 1. in columns s1 and s2: 0 = low and 1 = high. standard s1 (pin 5) s2 (pin 6) frequency vco1 (mhz) frequency vco2 (mhz) source selector connection b/g 1 1 5.5 5.74 pin 1 m 1 0 4.5 4.72 pin 3 i 0 1 6.0 off pin 16 d/k 0 0 6.5 6.74 pin 2
1996 nov 20 6 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 limiting values in accordance with the absolute maximum rating system (iec 134). notes 1. equivalent to discharging a 200 pf capacitor via a 0 w series resistor. 2. equivalent to discharging a 100 pf capacitor via a 1.5 k w series resistor. thermal characteristics symbol parameter conditions min. max. unit v p supply voltage (pin 14) - 0.5 +9.0 v v i input signal (pins 1, 2, 3, 15 and 16) - 0.5 +5.0 v v sw switching voltage (pins 5 and 6) - 0.5 v p + 0.5 v t s short-circuit time (each pin except pins 13 and 14 to be tested; one at the time) - 10 s t stg storage temperature device - 25 +125 c device in packing - 25 +85 c t j junction temperature - 150 c t amb operating ambient temperature 0 70 c v es electrostatic handling for all pins note 1 - 500 +500 v note 2 - 4000 +4000 v symbol parameter value unit r th j-a thermal resistance from junction to ambient in free air TDA9820 (dip16) 74 k/w TDA9820t (so16) 104 k/w
1996 nov 20 7 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 characteristics all voltages are measured to gnd (pin 13); v p =5v; t amb =25 c; d f i = 50 khz; f mod = 1 khz; v 1, 2, 3, 16/15 = 10 mv (rms value); measurements taken in fig.5; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply (pin 14) v p supply voltage 4.5 5.0 8.8 v i p supply current 23 30 37 ma source selector and limiter-ampli?er 1 (pins 1, 2, 3 and 16) v i dc input voltage activated input 2.25 2.5 2.75 v not activated input -- 0.1 v r i input resistance activated input 480 600 720 w not activated input -- 600 w v i(rms) input signal (rms value) - 150 250 m v allowed input signal (rms value) 200 -- mv a ct crosstalk attenuation not activated input to activated input 40 50 - db limiter-ampli?er 2 v 15 dc input voltage 2.25 2.5 2.75 v v 15(rms) input signal (rms value) ; note 1 - 150 250 m v input signal for mute off (rms value) 0.7 1.0 1.5 mv allowed input signal (rms value) 200 -- mv r 15 input resistance 480 600 720 w d hysteresis of level detector 8 12 16 db pll fm demodulators vco1 and vco2 f vco1 free-running frequencies r 11 =27k w ; see table 1 - 4.5 - mhz - 5.5 - mhz - 6.0 - mhz - 6.5 - mhz f vco2 free-running frequencies r 11 =27k w ; see table 1 - 4.7 - mhz - 5.7 - mhz - 6.7 - mhz d f fr negative/positive free-running frequency spread -- 10 % d/ d f fr drift of free-running frequencies t amb = 0 to 70 c - 500 750 khz d f fr(shift) shift of free-running frequencies 4.5 v < v p < 8.8 v - 200 300 khz d f fr(ar) negative/positive adjustment range of free-running frequencies r 11 =22k w 1 -- mhz r 11 adjustment resistance for free-running frequencies (pin 11) 15 - 29 k w sn + n -------------- 40 db = sn + n -------------- 40 db =
1996 nov 20 8 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 s negative slope of free-running frequency adjustment r 11 =22k w- 200 - khz/k w d f1 negative/positive catching range of plls 1.4 1.9 - mhz d f2 negative/positive holding range of plls 2.0 3.0 - mhz output ampli?ers af1 (pin 8) and af2 (pin 7) v o dc output voltage 1.8 2.1 2.5 v v o(rms) output signal (rms value) 0.4 0.5 0.6 v clipping level 1.2 -- v i m ac peak current -- 1.5 ma i o dc source current -- 2.0 ma d v o /v o absolute drift of af output signals t amb = 0 to 70 c - 0.7 - db d v o1 / d v o2 relative drift of af output signals t amb = 0 to 70 c - 0.2 - db d v af(1-2) negative/positive difference between output signals 50 m s de-emphasis - 0.3 1.0 db r o output resistance - 100 150 w a cs(ar) adjustment range of channel separation r s = 1.1 k w ; r pot = 2.2 k w 1.5 -- db thd total harmonic distortion 50 m s de-emphasis pin 8 - 0.1 0.3 % pin 7 - 0.25 0.5 % a am am suppression of af(1-2) 50 m s de-emphasis; m = 0.3; f am = 1 khz 46 66 - db signal plus noise-to-noise ratio 50 m s de-emphasis; in accordance with ccir 468-3 64 68 - db af resp low-level af frequency response d v af(1-2) = - 3db -- 20 hz high-level af frequency response 200 -- khz am res(rms) residual sound carrier signal and harmonics (rms value) - 50 80 mv a 8/7 crosstalk attenuation between af outputs f = 50 to 12500 hz 60 70 - db rr supply voltage ripple rejection v rr < 200 mv; f r =20hzto200khz v p =5v 16 20 - db v p =8v 24 28 - db rr supply voltage ripple rejection with improved application for v p =5v f r = 20 hz to 3 khz; see fig.3 and note 2 v p = 4.5 v 18 24 - db v p = 4.75 v 21 27 - db v p = 5.0 v 24 30 - db v p = 5.5 v 21 27 - db symbol parameter conditions min. typ. max. unit sn + n --------------
1996 nov 20 9 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 notes 1. the output signal at pin 7 can only be measured when mute is disabled. this is achieved by inserting a resistor of 2.7 k w between pin 15 and ground. in this event the input impedance is 490 w . 2. improvement of ripple rejection is possible by connecting series rc between pin 11 and pin 14 (15 k w + 2.2 m f; see fig.5) for a supply voltage of 4.5 to 5.5 v. the rejection of ripple frequencies up to 3 khz is improved, but up to 200 khz is worse; see fig.3. 3. an open pin (n.c.) is interpreted as high. control unit; see table 1 v 5,6 voltage for low level 0 - 0.8 v i 5,6 source current for low level 0 < v 5,6 < 0.8 - 180 250 m a r 5,6 allowed resistance to ground 0 < v 5,6 < 0.8 (low-level) -- 3.0 k w v 5 voltage for high level note 3 2.2 - v p v v 6 voltage for high level note 3 1.8 - v p v i 5,6 sink current for high level v 5, 6 =v p -- 10 m a symbol parameter conditions min. typ. max. unit fig.3 typical improvement. the curves are typical and valid for ripple frequencies between 50 hz and 3 khz. conditions: input signal: f = 5.5 mhz, 10 mv (rms value); ripple on v p = 100 mv (rms value), f r = 1 khz; ripple rejection measurement: unweighted rms. (1) without rc. (2) with r = 15 k w and c = 2.2 m f. handbook, full pagewidth 9 v p (v) 40 30 10 0 45678 rr (db) 20 mha530 (2) (1)
1996 nov 20 10 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 internal circuitry fig.4 internal circuitry. handbook, full pagewidth 16 1 15 2 14 3 13 4 12 5 11 6 10 7 9 8 mha421 TDA9820 5.5 k w 620 w 3.5 v 5.5 k w 620 w 3.5 v 5.5 k w 620 w 3.5 v n.c. 30 k w 6 k w 1 k w 6 k w 3.6 v 23 k w 13 k w 3.6 v 2 ma 100 w 2 ma 100 w 5.5 k w 620 w 3.5 v 5.5 k w 670 w 3.5 v + 10 k w 300 a 3 k w 3 k w 3.6 v 50 k w 2.54 v 5 k w af2 50 k w 2.54 v 5 k w af1
1996 nov 20 11 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 test and application information fig.5 test circuit. (1) see note 2 of chapter characteristics. handbook, full pagewidth 12 16 3 15 4 14 5 13 6 12 7 11 8 mha422 10 9 v p 10 nf v af2 TDA9820 2.2 nf s1 s2 n.c. v af1 2.2 k w v af2 v af1 2.2 k w 2.2 nf 2.2 nf 22 nf 22 nf with 50 s de-emphasis 10 f 5.5 mhz 2.2 nf 2.2 nf intercarrier intercarrier 2.2 f 2.2 f 600 w 600 w 600 w 600 w 600 w 6.5 mhz 4.5 mhz 6.0 mhz 4.72 mhz, or 5.74 mhz, or 6.74 mhz 27 k w 2.2 f without de-emphasis 2.2 k w 1.1 k w optional stereo channel separation adjustment r s r pot 15 k w 2.2 f (1) (1)
1996 nov 20 12 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 fig.6 application circuit. (1) resistor value depends on filter. handbook, full pagewidth 12 16 3 15 4 14 5 13 6 12 7 11 8 mha423 10 9 v p 10 nf v af2 TDA9820 s1 s2 n.c. v 10 f 5.5 mhz intercarrier 6.5 mhz 4.5 mhz 6.0 mhz 5.74 mhz af1 2.2 f 2.2 f 27 k w 2.2 f (1) (1) (1) (1) (1) r16 r15 r1 r2 r3
1996 nov 20 13 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 package outlines unit a max. 1 2 b 1 cee m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot38-1 92-10-02 95-01-19 a min. a max. b max. w m e e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050g09 mo-001ae m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 16 1 9 8 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) d (1) z dip16: plastic dual in-line package; 16 leads (300 mil); long body sot38-1
1996 nov 20 14 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013aa pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.055 0.42 0.39 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale 92-11-17 95-01-24 so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1
1996 nov 20 15 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so r eflow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1996 nov 20 16 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1996 nov 20 17 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 notes
1996 nov 20 18 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 notes
1996 nov 20 19 philips semiconductors product speci?cation multistandard/dual channel tv fm intercarrier sound demodulator TDA9820 notes
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